Core business

Silicon wafer grinding machine

WX-6007 Auto Silicon Wafer Grinding Machine
This machine is applicable for the ultra-precision grinding of Si, SC and LiTaO3 wafers. Grinding dia. range is 100mm~200mm; TTV≤3μm, Ra≤10nm. This machine is applicable for the ultra-precision grinding of wafer flatness and the thinner grinding of silicon wafer backside. It is suitable for the mass production.
I Machine structure features and performance 1. This machine is designed with three working stations and two spindles, and the grinding is realized by turning worktable, rough grinding and fine grinding; 2. Turing working table is designed as “Vapour rotation – Vacuum fixation”; 3. Grinding spindle system is constituted of grinding spindle, spindle seat, vertical pillar, and in-process measuring device for grinding force; Low friction cylinders on both sides of the spindle seat are used to balance the gravity of the spindle part and to increase the motion flexibility of the feed system; 4. Grinding spindle and part spindle are all designed with electric spindle with air static bearing, which with the advantages like high rotating precision, and low vibration, is conductive to the productivity improving and wafer surface roughness reduction; 5. Micro feed system is driven by servo motor through ball screw for grinding spindle for grinding and feed motion; Feed speed of this system, with 0.1 μm motion resolution, can achieve minimum 0.1 μm/s, and have a good response speed; 6. This machine is designed with auto position adjustment and thickness in-process measuring system; 7. There’s a micro adjustment device for the angle between grinding spindle and part spindle, so that to ensure the wafer’s surface shape; 8. This machine is designed with high precision and high reliability clamping positioning and conveying technology for the wafer, and with reliable automatic centering mechanism; A four-degree-freedom R-θ joint robot is used for wafer transport, so that realized the auto change between each working station. 9. This machine is designed with auto cleaning, drying and the auto cleaning for chuck, so that realize the wafer’s dry in and dry out in the grinding process;
II Machine technical specification and parameters Grinding wheel dia. 200mm Wafer transfer Manipulator Wafer chucking Vacuum adsorb Grinding wheel spindle number 2 Worktable number 3 Worktable cleaning Auto Worktable driven Electric spindle Min. feed rate 0.1μm Thickness measuring accuracy 0.1μm Grinding wheel speed 0~7000r/min Worktable rotate speed 0~300r/min Machine total power 20kW Grinding wheel power 4.2kW Worktable spindle power 0.5kW Machine overall dimension 2670x1200x1900 Machine net weight 3000Kg
	III Working accuracy Total thickness variation(TTV):≤ 3μm Wafer overall surface flatness(GBIR): ≤0.2μm Wafer partial surface flatness(SFQR): SFQR≤0.2μm Thickness vibration between wafers:≤3μm Surface roughness after fine grinding: Ra≤10nm(grinding with #3000 grinding wheel)

WX-6008 Auto Silicon Wafer Grinding Machine
This machine is applicable for the ultra-precision grinding of Si, SC and LiTaO3 wafers. Grinding dia. range is 200mm~300mm; TTV≤3μm,Ra≤10nm. This machine is applicable for the ultra-precision grinding of wafer flatness and the thinner grinding of silicon wafer backside which is less than 300mm. It is suitable for the mass production.
I Machine structure features and performance 1. This machine is designed with three working stations and two spindles, and the grinding is realized by turning worktable, rough grinding and fine grinding; 2. Turing working table is designed as “Vapour rotation – Vacuum fixation”; 3. Grinding spindle system is constituted of grinding spindle, spindle seat, vertical pillar, and in-process measuring device for grinding force; Low friction cylinders on both sides of the spindle seat are used to balance the gravity of the spindle part and to increase the motion flexibility of the feed system; 4. Grinding spindle and part spindle are all designed with electric spindle with air static bearing, which with the advantages like high rotating precision, and low vibration, is conductive to the productivity improving and wafer surface roughness reduction; 5. Micro feed system is driven by servo motor through ball screw for grinding spindle for grinding and feed motion; Feed speed of this system, with 0.1 μm motion resolution, can achieve minimum 0.1 μm/s, and have a good response speed; 6. This machine is designed with auto position adjustment and thickness in-process measuring system; 7. There’s a micro adjustment device for the angle between grinding spindle and part spindle, so that to ensure the wafer’s surface shape; 8. This machine is designed with high precision and high reliability clamping positioning and conveying technology for the wafer, and with reliable automatic centering mechanism; A four-degree-freedom R-θ joint manipulatoris used forwafer transport, so that realized the auto change between each working station. 9. This machine is designed with auto cleaning, drying and the auto cleaning for chuck, so that realize the wafer’s dry in and dry out in the grinding process;
II Machine technical specification and parameters Grinding wheel dia 300mm Wafer transfer Manipulator Wafer chucking Vacuum adsorb Grinding wheel spindle number 2 Worktable number 3 Worktable cleaning Auto Worktable driven Electric spindle Min. feed rate 0.1μm Thickness measuring accuracy 0.1μm Grinding wheel speed 0～7000r/min Worktable rotate speed 0～300r/min Machine total power 25KW Grinding wheel power 6.5KW Worktable spindle power 0.5KW Machine overall dimension 4196x1400x2111 Machine net weight 3500Kg
	III Working accuracy Total thickness variation(TTV) :≤ 3μm Wafer overall surface flatness(GBIR): ≤0.2μm Wafer partial surface flatness(SFQR): ≤0.2μm Thickness vibration between wafers:≤3μm Surface roughness after fine grinding: Ra≤10nm(grinding with #3000 grinding wheel)